Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2006
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2006
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| Subjects: |
| _version_ | 1826434834957860864 |
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| author | 397935 Koh, Joyce Swee Fong |
| author_facet | 397935 Koh, Joyce Swee Fong |
| author_sort | 397935 Koh, Joyce Swee Fong |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2006 |
| first_indexed | 2024-03-05T08:06:41Z |
| format | |
| id | KOHA-OAI-TEST:392282 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T08:06:41Z |
| publishDate | 2006 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:3922822020-12-19T17:13:41ZEffect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / 397935 Koh, Joyce Swee Fong Skudai : Universiti Teknologi Malaysia,2006engProject Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 200622PSZJBLSolder and solderingIntermetallic compounds |
| spellingShingle | Solder and soldering Intermetallic compounds 397935 Koh, Joyce Swee Fong Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / |
| title | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / |
| title_full | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / |
| title_fullStr | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / |
| title_full_unstemmed | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / |
| title_short | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] / |
| title_sort | effect of solder bump size on intermetallic compound formation during soldering on ni au surface finish compact disc |
| topic | Solder and soldering Intermetallic compounds |
| work_keys_str_mv | AT 397935kohjoycesweefong effectofsolderbumpsizeonintermetalliccompoundformationduringsolderingonniausurfacefinishcompactdisc |