Mechanism of IMC growth during non-linear solder reflow [compact disc] /

Lignende værker

• Mechanism of IMC growth during non-linear solder reflow /
  af: 374505 See, Phen Chiak
  Udgivet: (2006)
• Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
  af: 214468 Jalilah Che Mohamed
  Udgivet: (2006)
• Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG /
  af: 214468 Jalilah Che Mohamed
  Udgivet: (2006)
• Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
  af: Chua, Chai Ying, 1985-, et al.
  Udgivet: (2009)
• Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
  af: 170422 Chua, Chai Ying, et al.
  Udgivet: (2009)