177816 Wong, M. H., & Mekanikal, F. K. (2006). Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource]. Skudai : Universiti Teknologi Malaysia.
Cita Chicago (17th ed.)177816 Wong, Mun Hon, i Fakulti Kejuruteraan Mekanikal. Study of Dissolution Nickel Layer in Enig Surface Finish During Reflow Soldering [electronic Resource]. Skudai : Universiti Teknologi Malaysia, 2006.
Cita MLA (9th ed.)177816 Wong, Mun Hon, i Fakulti Kejuruteraan Mekanikal. Study of Dissolution Nickel Layer in Enig Surface Finish During Reflow Soldering [electronic Resource]. Skudai : Universiti Teknologi Malaysia, 2006.
Atenció: Aquestes cites poden no estar 100% correctes.