177816 Wong, M. H., & Mekanikal, F. K. (2006). Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource]. Skudai : Universiti Teknologi Malaysia.
Chicago-čujuhus (17. p.)177816 Wong, Mun Hon, juo Fakulti Kejuruteraan Mekanikal. Study of Dissolution Nickel Layer in Enig Surface Finish During Reflow Soldering [electronic Resource]. Skudai : Universiti Teknologi Malaysia, 2006.
MLA-čujuhus (9. p.)177816 Wong, Mun Hon, juo Fakulti Kejuruteraan Mekanikal. Study of Dissolution Nickel Layer in Enig Surface Finish During Reflow Soldering [electronic Resource]. Skudai : Universiti Teknologi Malaysia, 2006.
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