Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
| Main Authors: | , |
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| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2006
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| Subjects: |
| _version_ | 1826436827075051520 |
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| author | 177816 Wong, Mun Hon Fakulti Kejuruteraan Mekanikal |
| author_facet | 177816 Wong, Mun Hon Fakulti Kejuruteraan Mekanikal |
| author_sort | 177816 Wong, Mun Hon |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006 |
| first_indexed | 2024-03-05T08:36:20Z |
| format | |
| id | KOHA-OAI-TEST:402308 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T08:36:20Z |
| publishDate | 2006 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4023082020-12-19T17:14:02ZStudy of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / 177816 Wong, Mun Hon Fakulti Kejuruteraan Mekanikal Skudai : Universiti Teknologi Malaysia,2006engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006PSZJBLNickelSolder and soldering |
| spellingShingle | Nickel Solder and soldering 177816 Wong, Mun Hon Fakulti Kejuruteraan Mekanikal Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / |
| title | Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / |
| title_full | Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / |
| title_fullStr | Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / |
| title_full_unstemmed | Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / |
| title_short | Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] / |
| title_sort | study of dissolution nickel layer in enig surface finish during reflow soldering electronic resource |
| topic | Nickel Solder and soldering |
| work_keys_str_mv | AT 177816wongmunhon studyofdissolutionnickellayerinenigsurfacefinishduringreflowsolderingelectronicresource AT fakultikejuruteraanmekanikal studyofdissolutionnickellayerinenigsurfacefinishduringreflowsolderingelectronicresource |