Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] /

Eitemau Tebyg

• Study of dissolution nickel layer in enig surface finish during reflow soldering /
  gan: 177816 Wong, Mun Hon, et al.
  Cyhoeddwyd: (2006)
• Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM /
  gan: 340491 Phang, Chin Ewe
  Cyhoeddwyd: (2003)
• Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
  gan: 288113 Siti Rabiatull Aisha Idris, et al.
  Cyhoeddwyd: (2006)
• Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes /
  gan: Nurfazlin Abu Hassan, 1984-, et al.
  Cyhoeddwyd: (2009)
• Interfacial reactions between lead-free solders and ENIG/ENEPIG surface finishes /
  gan: 282552 Saszlena Rasmi
  Cyhoeddwyd: (2006)