Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
Main Authors: | 177816 Wong, Mun Hon, Fakulti Kejuruteraan Mekanikal |
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Format: | |
Language: | eng |
Published: |
Skudai : Universiti Teknologi Malaysia,
2006
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Subjects: |
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