Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Detalhes bibliográficos
Principais autores: 177816 Wong, Mun Hon, Fakulti Kejuruteraan Mekanikal
Formato:
Idioma:eng
Publicado em: Skudai : Universiti Teknologi Malaysia, 2006
Assuntos: