Evaluation of different lead free solders : a study on intermetallics [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2006
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| Subjects: |
| _version_ | 1826436828076441600 |
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| author | 457654 Lim, Chong Kheng |
| author_facet | 457654 Lim, Chong Kheng |
| author_sort | 457654 Lim, Chong Kheng |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006 |
| first_indexed | 2024-03-05T08:36:21Z |
| format | |
| id | KOHA-OAI-TEST:402313 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T08:36:21Z |
| publishDate | 2006 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4023132020-12-19T17:14:02ZEvaluation of different lead free solders : a study on intermetallics [compact disc] / 457654 Lim, Chong Kheng Skudai : Universiti Teknologi Malaysia,2006engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 200622PSZJBLSolder and solderingIntermetallic compoundsElectronic packaging |
| spellingShingle | Solder and soldering Intermetallic compounds Electronic packaging 457654 Lim, Chong Kheng Evaluation of different lead free solders : a study on intermetallics [compact disc] / |
| title | Evaluation of different lead free solders : a study on intermetallics [compact disc] / |
| title_full | Evaluation of different lead free solders : a study on intermetallics [compact disc] / |
| title_fullStr | Evaluation of different lead free solders : a study on intermetallics [compact disc] / |
| title_full_unstemmed | Evaluation of different lead free solders : a study on intermetallics [compact disc] / |
| title_short | Evaluation of different lead free solders : a study on intermetallics [compact disc] / |
| title_sort | evaluation of different lead free solders a study on intermetallics compact disc |
| topic | Solder and soldering Intermetallic compounds Electronic packaging |
| work_keys_str_mv | AT 457654limchongkheng evaluationofdifferentleadfreesoldersastudyonintermetallicscompactdisc |