Evaluation of different lead free solders : a study on intermetallics [compact disc] /

Evaluation of different lead free solders : a study on intermetallics [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author:	457654 Lim, Chong Kheng
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2006
Subjects:	Solder and soldering Intermetallic compounds Electronic packaging

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