Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2006
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| Subjects: |
| _version_ | 1826437258754916352 |
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| author | 214468 Jalilah Che Mohamed |
| author_facet | 214468 Jalilah Che Mohamed |
| author_sort | 214468 Jalilah Che Mohamed |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006 |
| first_indexed | 2024-03-05T08:42:44Z |
| format | |
| id | KOHA-OAI-TEST:404436 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T08:42:44Z |
| publishDate | 2006 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4044362020-12-19T17:14:07ZNickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / 214468 Jalilah Che Mohamed Skudai : Universiti Teknologi Malaysia,2006engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 200622PSZJBLSolder and solderingIntermetallic compounds |
| spellingShingle | Solder and soldering Intermetallic compounds 214468 Jalilah Che Mohamed Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / |
| title | Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / |
| title_full | Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / |
| title_fullStr | Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / |
| title_full_unstemmed | Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / |
| title_short | Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] / |
| title_sort | nickel layer consumption during reflow soldering between sn ag cu and enepig compact disc |
| topic | Solder and soldering Intermetallic compounds |
| work_keys_str_mv | AT 214468jalilahchemohamed nickellayerconsumptionduringreflowsolderingbetweensnagcuandenepigcompactdisc |