Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author:	214468 Jalilah Che Mohamed
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2006
Subjects:	Solder and soldering Intermetallic compounds

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