Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author: 285723 Yusreena Yusuf
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2006
Subjects:
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author 285723 Yusreena Yusuf
author_facet 285723 Yusreena Yusuf
author_sort 285723 Yusreena Yusuf
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
first_indexed 2024-03-05T08:42:48Z
format
id KOHA-OAI-TEST:404460
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T08:42:48Z
publishDate 2006
publisher Skudai : Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:4044602020-12-19T17:14:07ZIntermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] / 285723 Yusreena Yusuf Skudai : Universiti Teknologi Malaysia,2006engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 200622PSZJBLSolder and solderingIntermetallic compounds
spellingShingle Solder and soldering
Intermetallic compounds
285723 Yusreena Yusuf
Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
title Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
title_full Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
title_fullStr Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
title_full_unstemmed Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
title_short Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
title_sort intermetallic formation during soldering on epig and cu surface finishes electronic resource
topic Solder and soldering
Intermetallic compounds
work_keys_str_mv AT 285723yusreenayusuf intermetallicformationduringsolderingonepigandcusurfacefinisheselectronicresource