Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliografiska uppgifter
Huvudupphovsman:	285723 Yusreena Yusuf
Materialtyp:
Språk:	eng
Publicerad:	Skudai : Universiti Teknologi Malaysia, 2006
Ämnen:	Solder and soldering Intermetallic compounds

Liknande verk

Intermetallic formation during soldering on EPIG and Cu surface finishes /
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Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
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Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
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Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
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Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
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Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
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The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
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The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
av: 200265 Moey, Chin Boon
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Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
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Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /
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Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
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Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
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Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
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Effect of flux type on intermetallics formation in solder joint /
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Effect of flux type on intermetallics formation in solder joint [compact disc] /
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Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
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Interfacial reactions between lead-free solders and ENIG/ENEPIG surface finishes /
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Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
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Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
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Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /
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Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
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Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG /
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Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes [electronic resource] /
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Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
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Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
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Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /
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Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
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Evaluation of different lead free solders : a study on intermetallics /
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Mechanism of IMC growth during non-linear solder reflow /
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Evaluation of different lead free solders : a study on intermetallics [compact disc] /
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