Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
| Main Author: | |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
2007
|
| Subjects: |
| _version_ | 1796729490666160128 |
|---|---|
| author | 323613 Azizah Wahi |
| author_facet | 323613 Azizah Wahi |
| author_sort | 323613 Azizah Wahi |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-05T08:57:37Z |
| format | |
| id | KOHA-OAI-TEST:409337 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T08:57:37Z |
| publishDate | 2007 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4093372020-12-19T17:14:17ZInterfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / 323613 Azizah Wahi 2007engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesPSZJBLIntegrated circuitsIntermetallic compounds |
| spellingShingle | Integrated circuits Intermetallic compounds 323613 Azizah Wahi Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / |
| title | Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / |
| title_full | Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / |
| title_fullStr | Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / |
| title_full_unstemmed | Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / |
| title_short | Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] / |
| title_sort | interfacial reactions between sn ag cu solder and cu ni pd and cu ni au surface finishes electronic resource |
| topic | Integrated circuits Intermetallic compounds |
| work_keys_str_mv | AT 323613azizahwahi interfacialreactionsbetweensnagcusolderandcunipdandcuniausurfacefinisheselectronicresource |