Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] /

Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Author:	323613 Azizah Wahi
Format:
Language:	eng
Published:	2007
Subjects:	Integrated circuits Intermetallic compounds

Similar Items

Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes /
by: 323613 Azizah Wahi, et al.
Published: (2007)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
by: Chin, Ee Mei, 1986-, et al.
Published: (2010)

Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints
by: Xuewei Zhu, et al.
Published: (2019-05-01)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
by: Chin, Ee Mei, 1986-
Published: (2010)

Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish /
by: Chia, Xing Nian, 1987-, et al.
Published: (2011)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)

Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows
by: M.S. Chang, et al.
Published: (2023-09-01)

Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders
by: Nagy E., et al.
Published: (2015-06-01)

Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish [electronic resource] /
by: Chia, Xing Nian, 1987-, et al.
Published: (2011)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
by: 458317 Liew, Chung Wah
Published: (2007)

A Study on the Interfacial Reactions between Gallium and Cu/Ni/Au(Pd) Multilayer Metallization
by: Byungwoo Kim, et al.
Published: (2023-09-01)

Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints
by: Yanfeng Du, et al.
Published: (2023-04-01)

Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes
by: F., Nor Akmal, et al.
Published: (2007)

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
by: Siliang He, et al.
Published: (2022-11-01)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
by: 200265 Moey, Chin Boon
Published: (2005)

Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
by: 288113 Siti Rabiatull Aisha Idris, et al.
Published: (2006)

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2015)

Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2015)

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2015)

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
by: M.A. Azmah Hanim, et al.
Published: (2015-12-01)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG /
by: 214468 Jalilah Che Mohamed
Published: (2006)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
by: Moey, Chin Boon
Published: (2006)

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
by: Noor Afzan Muhamad, 1985-, et al.
Published: (2008)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
by: 200265 Moey, Chin Boon
Published: (2005)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
by: 285723 Yusreena Yusuf
Published: (2006)

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading
by: Zhigang Li, et al.
Published: (2023-07-01)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /
by: 399565 Tai, Siew Fong
Published: (2003)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
by: Tan, Luyeen, 1986-, et al.
Published: (2010)

Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures
by: Chaoyu Chen, et al.
Published: (2022-01-01)

Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints
by: Minho Oh, et al.
Published: (2024-03-01)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
by: Koid, Chun Ping, 1987-, et al.
Published: (2011)

Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /
by: 396114 Nordiana Najib
Published: (2004)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
by: 214468 Jalilah Che Mohamed
Published: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
by: Noor Afzan Muhamad, 1985-
Published: (2008)

Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
by: Nai, S. M. L., et al.
Published: (2013)