Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2007
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Skudai : Universiti Teknologi Malaysia,
2007
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| _version_ | 1826438274341666816 |
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| author | Ch'ng, Emily Huey Ling, 1984- |
| author_facet | Ch'ng, Emily Huey Ling, 1984- |
| author_sort | Ch'ng, Emily Huey Ling, 1984- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-05T08:57:52Z |
| format | |
| id | KOHA-OAI-TEST:409422 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-05T08:57:52Z |
| publishDate | 2007 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4094222020-12-19T17:14:17ZIntermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] Ch'ng, Emily Huey Ling, 1984- Skudai : Universiti Teknologi Malaysia,2007Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesPSZJBLSolder and solderingIntegrated circuits |
| spellingShingle | Solder and soldering Integrated circuits Ch'ng, Emily Huey Ling, 1984- Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] |
| title | Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] |
| title_full | Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] |
| title_fullStr | Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] |
| title_full_unstemmed | Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] |
| title_short | Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc] |
| title_sort | intermetallic formation during soldering between lead free solders and immersion silver surface finish compact disc |
| topic | Solder and soldering Integrated circuits |
| work_keys_str_mv | AT chngemilyhueyling1984 intermetallicformationduringsolderingbetweenleadfreesoldersandimmersionsilversurfacefinishcompactdisc |