Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Author:	Ch'ng, Emily Huey Ling, 1984-
Format:
Published:	Skudai : Universiti Teknologi Malaysia, 2007
Subjects:	Solder and soldering Integrated circuits

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