Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
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2007
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| _version_ | 1826438506012999680 |
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| author | 452473 Cheah, Ui Ping |
| author_facet | 452473 Cheah, Ui Ping |
| author_sort | 452473 Cheah, Ui Ping |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-05T09:01:18Z |
| format | |
| id | KOHA-OAI-TEST:410558 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-05T09:01:18Z |
| publishDate | 2007 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4105582020-12-19T17:14:20ZFinite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / 452473 Cheah, Ui Ping 2007Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesPSZJBLFinite element methodPrinted circuits |
| spellingShingle | Finite element method Printed circuits 452473 Cheah, Ui Ping Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / |
| title | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / |
| title_full | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / |
| title_fullStr | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / |
| title_full_unstemmed | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / |
| title_short | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] / |
| title_sort | finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product electronic resource |
| topic | Finite element method Printed circuits |
| work_keys_str_mv | AT 452473cheahuiping finiteelementsimulationofdropimpactofprintedcircuitboardpackageassemblyofgenericmobileelectronicsproductelectronicresource |