Methodology for hyvbrid experimental numerical determination of solder/intermetallic interface shear strength [electronic resource] /

Methodology for hyvbrid experimental numerical determination of solder/intermetallic interface shear strength [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Author:	Low, Kok Wai, 1984-
Format:
Published:	2007
Subjects:	Solder and soldering

Similar Items

Methodology for hybrid experimental-numerical determination of solder/intermetallic interface shear strength /
by: Low, Kok Wai, 1984-, et al.
Published: (2007)

Mechanics of solder joints and solder / intermetallic interface under temperature and mechanical loading /
by: 401100 Fethma M. Nor, et al.
Published: (2009)

Mechanics of solder joints and solder / intermetallic interface under temperature and mechanical loading [electronic resource] /
by: 401100 Fethma M. Nor, et al.
Published: (2009)

Intermetallic compounds (IMC) formation during soldering /
by: Zureena Abu Samah, 1985-, et al.
Published: (2008)

Effect of flux type on intermetallics formation in solder joint [microform] /
by: Cheong, Jeng Seng, et al.
Published: (2005)

Intermetallic compounds (IMC) formation during soldering [electronic resource] /
by: Zureena Abu Samah, 1985-
Published: (2008)

Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish /
by: Azizah Wahi, 1984-, et al.
Published: (2009)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /
by: Ch'ng, Emily Huey Ling, 1984-, et al.
Published: (2007)

Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish [electronic resource] /
by: Azizah Wahi, 1984-, et al.
Published: (2009)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]
by: Ch'ng, Emily Huey Ling, 1984-
Published: (2007)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
by: Koid, Chun Ping, 1987-, et al.
Published: (2011)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
by: Koid, Chun Ping, 1987-
Published: (2011)

Effect of flux type on intermetallics formation in solder joint /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
by: 351526 Tan, Kok Hoong
Published: (2006)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
by: 285723 Yusreena Yusuf
Published: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
by: 351526 Tan, Kok Hoong
Published: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]
by: Koh, Joyce Swee Fong
Published: (2006)

Effect of flux type on intermetallics formation in solder joint [compact disc] /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
by: 285723 Yusreena Yusuf
Published: (2006)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
by: Chua, Chai Ying, 1985-, et al.
Published: (2009)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model /
by: Aliff Farhan Mohd. Yamin, 1986-, et al.
Published: (2012)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
by: 458141 Mah, Chia Wen
Published: (2003)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
by: 458317 Liew, Chung Wah
Published: (2007)

Soldering /
by: 247850 Thwaites, C. J., et al.
Published: (1975)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
by: 380319 Ching, Sze Pei
Published: (2006)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
by: 458460 Wong, Lee Kian
Published: (2003)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
by: 170422 Chua, Chai Ying, et al.
Published: (2009)

How to prevent soldering defect in wave soldering process /
by: 439621 Lok, Chee Han
Published: (2002)

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model [electronic resource] /
by: Aliff Farhan Mohd. Yamin, 1986-
Published: (2012)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Soldering manual /
by: 8940 American Welding Society
Published: (1978)

Soldering manual
by: 8940 American Welding Society
Published: (1959)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes [electronic resource] /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
by: 458460 Wong, Lee Kian
Published: (2003)

Evaluation of different lead free solders : a study on intermetallics /
by: 457654 Lim, Chong Kheng
Published: (2006)