Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes [electronic resource] /

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes [electronic resource] /

Thesis (Sarjana Kejuruteraan (Mekanikal Bahan)) - Universiti Teknologi Malaysia, 2009

Bibliographic Details
Main Authors:	Nurfazlin Abu Hassan, 1984-, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2009
Subjects:	Solder and soldering

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