Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008
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| Format: | |
| Language: | eng |
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2008
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| _version_ | 1796730438227591168 |
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| author | Nor Diyana Mutalif, 1985- |
| author_facet | Nor Diyana Mutalif, 1985- |
| author_sort | Nor Diyana Mutalif, 1985- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008 |
| first_indexed | 2024-03-05T09:11:05Z |
| format | |
| id | KOHA-OAI-TEST:413780 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:11:05Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4137802020-12-19T17:14:27ZInterfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / Nor Diyana Mutalif, 1985- 2008engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008Includes bibliographical referencesPSZJBLElectronic packagingSolder and soldering |
| spellingShingle | Electronic packaging Solder and soldering Nor Diyana Mutalif, 1985- Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / |
| title | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / |
| title_full | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / |
| title_fullStr | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / |
| title_full_unstemmed | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / |
| title_short | Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] / |
| title_sort | interfacial reactions between sn 3 0ag 0 5cu solder and immersion silver surface finish electronic resource |
| topic | Electronic packaging Solder and soldering |
| work_keys_str_mv | AT nordiyanamutalif1985 interfacialreactionsbetweensn30ag05cusolderandimmersionsilversurfacefinishelectronicresource |