Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

Bibliographic Details
Main Author:	Nor Diyana Mutalif, 1985-
Format:
Language:	eng
Published:	2008
Subjects:	Electronic packaging Solder and soldering

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