Classical and damage mechanics-based models for lead-free solder interconnects [electronic resource] /

Classical and damage mechanics-based models for lead-free solder interconnects [electronic resource] /

Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009

Bibliographic Details
Main Authors:	Lai, Zheng Bo, 1984-, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2009
Subjects:	Electronic apparatus and appliances Solder and soldering Joints (Engineering)

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