Wire bonding in microelectronics [electronic resource] /
16
| Main Author: | |
|---|---|
| Format: | |
| Language: | eng |
| Published: |
New York : McGraw-Hill,
2010
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| Subjects: |
| _version_ | 1796731536353001472 |
|---|---|
| author | 364840 Harman, George |
| author_facet | 364840 Harman, George |
| author_sort | 364840 Harman, George |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-05T09:26:07Z |
| format | |
| id | KOHA-OAI-TEST:418798 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:26:07Z |
| publishDate | 2010 |
| publisher | New York : McGraw-Hill, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4187982020-12-19T17:14:41ZWire bonding in microelectronics [electronic resource] / 364840 Harman, George New York : McGraw-Hill,2010eng16PSZJBLWire bonding (Electronic packaging)Electronic packagingElectronic packagingSemiconductorsURN:ISBN:9780071476232URN:ISBN:9780071703345 |
| spellingShingle | Wire bonding (Electronic packaging) Electronic packaging Electronic packaging Semiconductors 364840 Harman, George Wire bonding in microelectronics [electronic resource] / |
| title | Wire bonding in microelectronics [electronic resource] / |
| title_full | Wire bonding in microelectronics [electronic resource] / |
| title_fullStr | Wire bonding in microelectronics [electronic resource] / |
| title_full_unstemmed | Wire bonding in microelectronics [electronic resource] / |
| title_short | Wire bonding in microelectronics [electronic resource] / |
| title_sort | wire bonding in microelectronics electronic resource |
| topic | Wire bonding (Electronic packaging) Electronic packaging Electronic packaging Semiconductors |
| work_keys_str_mv | AT 364840harmangeorge wirebondinginmicroelectronicselectronicresource |