The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005
| Autor principal: | |
|---|---|
| Formato: | |
| Lenguaje: | eng |
| Publicado: |
Skudai : Universiti Teknologi Malaysia,
2005
|
| Materias: |
| Sumario: | Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005 |
|---|