The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005

Detalhes bibliográficos
Autor principal: 200265 Moey, Chin Boon
Formato:
Idioma:eng
Publicado em: Skudai : Universiti Teknologi Malaysia, 2005
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Resumo:Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005