The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2005
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| Subjects: |
| _version_ | 1826441372654108672 |
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| author | 200265 Moey, Chin Boon |
| author_facet | 200265 Moey, Chin Boon |
| author_sort | 200265 Moey, Chin Boon |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T09:43:29Z |
| format | |
| id | KOHA-OAI-TEST:424598 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:43:29Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4245982020-12-19T17:14:54ZThe effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / 200265 Moey, Chin Boon Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 200522PSZJBLSolder and solderingIntermetallic compounds |
| spellingShingle | Solder and soldering Intermetallic compounds 200265 Moey, Chin Boon The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / |
| title | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / |
| title_full | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / |
| title_fullStr | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / |
| title_full_unstemmed | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / |
| title_short | The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] / |
| title_sort | effects of heat treatment on the formation of intermetallics formation of solder joints between sn ag cu and eutectic pb sn solders and electroless nickel immersion gold surface finish compact disc |
| topic | Solder and soldering Intermetallic compounds |
| work_keys_str_mv | AT 200265moeychinboon theeffectsofheattreatmentontheformationofintermetallicsformationofsolderjointsbetweensnagcuandeutecticpbsnsoldersandelectrolessnickelimmersiongoldsurfacefinishcompactdisc AT 200265moeychinboon effectsofheattreatmentontheformationofintermetallicsformationofsolderjointsbetweensnagcuandeutecticpbsnsoldersandelectrolessnickelimmersiongoldsurfacefinishcompactdisc |