The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author:	200265 Moey, Chin Boon
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2005
Subjects:	Solder and soldering Intermetallic compounds

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