Deformation response of lead-free solder [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005
| Main Author: | |
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| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2005
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| Subjects: |
| _version_ | 1826441392750067712 |
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| author | 288646 Koh, Ching Theng |
| author_facet | 288646 Koh, Ching Theng |
| author_sort | 288646 Koh, Ching Theng |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T09:43:47Z |
| format | |
| id | KOHA-OAI-TEST:424697 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:43:47Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4246972020-12-19T17:14:54ZDeformation response of lead-free solder [compact disc] / 288646 Koh, Ching Theng Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 200516PSZJBLElectronic packagingSolder and soldering |
| spellingShingle | Electronic packaging Solder and soldering 288646 Koh, Ching Theng Deformation response of lead-free solder [compact disc] / |
| title | Deformation response of lead-free solder [compact disc] / |
| title_full | Deformation response of lead-free solder [compact disc] / |
| title_fullStr | Deformation response of lead-free solder [compact disc] / |
| title_full_unstemmed | Deformation response of lead-free solder [compact disc] / |
| title_short | Deformation response of lead-free solder [compact disc] / |
| title_sort | deformation response of lead free solder compact disc |
| topic | Electronic packaging Solder and soldering |
| work_keys_str_mv | AT 288646kohchingtheng deformationresponseofleadfreesoldercompactdisc |