Deformation response of lead-free solder [compact disc] /

Deformation response of lead-free solder [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Author:	288646 Koh, Ching Theng
Format:
Language:	eng
Published:	Skudai : Universiti Teknologi Malaysia, 2005
Subjects:	Electronic packaging Solder and soldering

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