Quality improvement of solder paste printing process using six sigma methodology [compact disc] /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005

Podrobná bibliografie
Hlavní autor: 289882 Wong, Jing Hao
Médium:
Jazyk:eng
Vydáno: Skudai : Universiti Teknologi Malaysia, 2005
Témata: