Quality improvement of solder paste printing process using six sigma methodology [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005
Hlavní autor: | |
---|---|
Médium: | |
Jazyk: | eng |
Vydáno: |
Skudai : Universiti Teknologi Malaysia,
2005
|
Témata: |