Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] /
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2005
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| フォーマット: | |
| 言語: | eng |
| 出版事項: |
Skudai : Universiti Teknologi Malaysia,
2005
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| 主題: |
| _version_ | 1826441431126900736 |
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| author | 295860 Chong, Wan Guan |
| author_facet | 295860 Chong, Wan Guan |
| author_sort | 295860 Chong, Wan Guan |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T09:44:21Z |
| format | |
| id | KOHA-OAI-TEST:424888 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:44:21Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4248882020-12-19T17:14:55ZCharacteristics of stress and strain field in organic substrate of a flip chip [compact disc] / 295860 Chong, Wan Guan Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 200516PSZJBLMultichip modules (Microelectronics) |
| spellingShingle | Multichip modules (Microelectronics) 295860 Chong, Wan Guan Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] / |
| title | Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] / |
| title_full | Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] / |
| title_fullStr | Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] / |
| title_full_unstemmed | Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] / |
| title_short | Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] / |
| title_sort | characteristics of stress and strain field in organic substrate of a flip chip compact disc |
| topic | Multichip modules (Microelectronics) |
| work_keys_str_mv | AT 295860chongwanguan characteristicsofstressandstrainfieldinorganicsubstrateofaflipchipcompactdisc |