Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] /

Characteristics of stress and strain field in organic substrate of a flip chip [compact disc] /

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2005

书目详细资料
主要作者:	295860 Chong, Wan Guan
格式:
语言:	eng
出版:	Skudai : Universiti Teknologi Malaysia, 2005
主题:	Multichip modules (Microelectronics)

相似书籍

Characteristics of stress and strain field in organic substrate of a flip chip /
由: 295860 Chong, Wan Guan
出版: (2005)

Area array packaging processes : for BGA, Flip Chip, and CSP /
由: Gilleo, Ken
出版: (2004)

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
由: 303750 Lau, John H.
出版: (2000)

Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies /
由: 303750 Lau, John H.
出版: (2000)

Multichip module design, fabrication, and testing /
由: 463530 Licari, James J.
出版: (1995)

Introduction to system on package : miniaturization of the entire system /
由: 225994 Tummala, Rao R., et al.
出版: (2008)

Electronics packaging forum : multichip module technology issues /
由: Morris, James E., 1944-
出版: (1994)

Multichip modules and related technologies : MCM, TAB and COB Design /
由: 416933 Ginsberg, Gerald L., et al.
出版: (1994)

Routing in the third dimension : from VLSI chips to MCMs /
由: 290513 Sherwani, Naveed A., et al.
出版: (1995)

System-in-package RF design and applications /
由: 452860 Gaynor, Michael P.
出版: (2007)

Multichip modules with integrated sensors /
由: Jones, W. Kinzy, et al.
出版: (1996)

Microelectronics failure analysis [compact disc] : desk reference /
由: Electronic Device Failure Analysis Society. Desk Reference Committee
出版: (2004)

Thick film technology and chip joining/
由: 308224 Miller, Lewis F.
出版: (1972)

Arbitration schemes of wishbone on chip bus system /
由: Ong, Kok Tong, 1988- author, et al.
出版: (2014)

Microsystem engineering of lab-on-a-chip devices /
由: 391197 Geschke, Oliver, et al.
出版: (2008)

Microsystem engineering of lab-on-a-chip devices /
由: 391197 Geschke, Oliver, et al.
出版: (2004)

Arbitration schemes of wishbone on chip bus system [electronic resource] /
由: Ong, Kok Tong, 1988- author, et al.
出版: (2014)

Substrate warpage analysis during solder reflow process /
由: 384464 Beh, Keh Shin
出版: (2004)

Design and modeling of on-chip planar capacitor for RF application /
由: 413932 Mariyatul Qibthiyah Mohd. Noor
出版: (2006)

Thermal stress and strain analysis in a solder joint of a flip chip /
由: 441119 Quah, Wan Ching
出版: (2001)

Modeling of electrostatic actuated MEMS cantilever beam for application as optical switch [compact disc] /
由: 361243 Leow, Cheah Wei
出版: (2002)

Design and modeling of on-chip planar capacitor for RF application [electronic resource] /
由: 413932 Mariyatul Qibthiyah Mohd. Noor
出版: (2006)

Process development of nanowires for off-chip interconnects
由: Chong, Ser Choong.
出版: (2008)

Advanced wafer bonding for substrate engineering and 3D IC integration
由: Chong, Gang Yih
出版: (2014)

Chip scale package (CSP): design, materials, processes, reliability, and applications /
由: 303750 Lau, John H., et al.
出版: (1998)

Electrical design, modelling and optimization of a low-cost wafer level chip scale package (WL-CSP)
由: Low, Hong Guan.
出版: (2008)

Microfluidic chip for detection of protozoan parasites
由: Zainab Che Omar
出版: (2013)

Microfluidic cell culture chip and array
由: Gu, Jingjing.
出版: (2009)

Simulation of tunneling phenomena of single electron transistor using simulation of nano-structure (Simon) software [compact disc] /
由: 299305 Nik Muhammad Kamil Nik Razali
出版: (2006)

Microelectronics failure analysis : desk reference /
由: Electronic Device Failure Analysis Society. Desk Reference Committee
出版: (2004)

Microelectronic engineering : an international journal of semiconductor manufacturing technology
出版: (1983)

Microelectronic engineering : an international journal of semiconductor manufacturing technology [electronic journal]

Compact Integrated On-Chip MIMO Antenna with Reconfigurability for mmWave Frequencies
由: Khaled Boubekeur, et al.
出版: (2025-02-01)

Lab-on-a-chip for biology cell sorting
由: Mohamad Zaki Buang.
出版: (2013)

The effects of space charge, dopants, and strain fields on surfaces and grain boundaries in YBCO compounds
由: Su, Haibin, et al.
出版: (2011)

System-on-chip : next generation electronics /
由: Al-Hashimi, Bashir M., et al.
出版: (2006)

Effects of strain/stress on quantum dots and nano-devices.
由: Shen, Zexiang.
出版: (2009)

A small step towards solving the global chip shortage problem – physical failure analysis
由: Tan, Yi Kai
出版: (2022)

Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate
由: Hu, YingYong
出版: (2011)

Development of a lab on a chip for nerve agent detection
由: Tan, Hsih Yin
出版: (2010)