Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010
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| Format: | |
| Language: | eng |
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2010
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| _version_ | 1826444372216905728 |
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| author | Ng, Mei Wah, 1986- |
| author_facet | Ng, Mei Wah, 1986- |
| author_sort | Ng, Mei Wah, 1986- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010 |
| first_indexed | 2024-03-05T10:26:59Z |
| format | |
| id | KOHA-OAI-TEST:439074 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T10:26:59Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4390742020-12-19T17:15:49ZEffect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / Ng, Mei Wah, 1986- 2010engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010Includes bibliographical referencesPSZJBLIntermetallic compoundsSolder and solderingElectronic packaging |
| spellingShingle | Intermetallic compounds Solder and soldering Electronic packaging Ng, Mei Wah, 1986- Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / |
| title | Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / |
| title_full | Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / |
| title_fullStr | Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / |
| title_full_unstemmed | Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / |
| title_short | Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] / |
| title_sort | effect of nickel dopant on intermetallic compound formation between sn ag cu solders and electroless nickel boron immersion gold electronic resource |
| topic | Intermetallic compounds Solder and soldering Electronic packaging |
| work_keys_str_mv | AT ngmeiwah1986 effectofnickeldopantonintermetalliccompoundformationbetweensnagcusoldersandelectrolessnickelboronimmersiongoldelectronicresource |