Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] /

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

Bibliographic Details
Main Author:	Ng, Mei Wah, 1986-
Format:
Language:	eng
Published:	2010
Subjects:	Intermetallic compounds Solder and soldering Electronic packaging

Similar Items

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
by: Ng, Mei Wah, 1986-, et al.
Published: (2010)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
by: 200265 Moey, Chin Boon
Published: (2005)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
by: Moey, Chin Boon
Published: (2006)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
by: 200265 Moey, Chin Boon
Published: (2005)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
by: 380319 Ching, Sze Pei
Published: (2006)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
by: 458141 Mah, Chia Wen
Published: (2003)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
by: 458317 Liew, Chung Wah
Published: (2007)

Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
by: 183648 Ali Ourdjini, et al.
Published: (2007)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG /
by: 214468 Jalilah Che Mohamed
Published: (2006)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
by: 214468 Jalilah Che Mohamed
Published: (2006)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
by: 458460 Wong, Lee Kian
Published: (2003)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
by: 458460 Wong, Lee Kian
Published: (2003)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
by: Chin, Ee Mei, 1986-, et al.
Published: (2010)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
by: 351526 Tan, Kok Hoong
Published: (2006)

Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
by: 288113 Siti Rabiatull Aisha Idris, et al.
Published: (2006)

Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM /
by: 340491 Phang, Chin Ewe
Published: (2003)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
by: Chua, Chai Ying, 1985-, et al.
Published: (2009)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
by: Chin, Ee Mei, 1986-
Published: (2010)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
by: Noor Afzan Muhamad, 1985-, et al.
Published: (2008)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
by: 351526 Tan, Kok Hoong
Published: (2006)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /
by: Saliza Azlina Osman, 1982-, et al.
Published: (2012)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
by: Tan, Luyeen, 1986-, et al.
Published: (2010)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
by: Koid, Chun Ping, 1987-, et al.
Published: (2011)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes [electronic resource] /
by: Saliza Azlina Osman, 1982-
Published: (2012)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
by: 170422 Chua, Chai Ying, et al.
Published: (2009)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
by: Noor Afzan Muhamad, 1985-
Published: (2008)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /
by: Tan, Luyeen, 1986-
Published: (2010)

Evaluation of different lead free solders : a study on intermetallics /
by: 457654 Lim, Chong Kheng
Published: (2006)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
by: Koid, Chun Ping, 1987-
Published: (2011)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
by: 285723 Yusreena Yusuf
Published: (2006)

Evaluation of different lead free solders : a study on intermetallics [compact disc] /
by: 457654 Lim, Chong Kheng
Published: (2006)

Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /
by: 396114 Nordiana Najib
Published: (2004)

Intermetallics in lead-free solder on direct immersion gold under bump metallugy /
by: Chew, Li Ling, 1981-
Published: (2003)

Effect of flux type on intermetallics formation in solder joint /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
by: 285723 Yusreena Yusuf
Published: (2006)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Effect of flux type on intermetallics formation in solder joint [compact disc] /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish /
by: Nor Diyana Mutalif, 1985-, et al.
Published: (2008)