Recovery and accumulation of high-purity hydrogen with the use of hydride-forming intermetallic compounds/

Recovery and accumulation of high-purity hydrogen with the use of hydride-forming intermetallic compounds/

PSZJBL

Bibliographic Details
Main Authors:	495976 Tarasov, B. P., Shilkin, S. P.
Format:
Language:	eng
Subjects:	Hydrogen Intermetallic compounds

Similar Items

Intermetallic Compounds Synthesized by Mechanical Alloying for Solid-State Hydrogen Storage: A Review
by: Yuchen Liu, et al.
Published: (2021-09-01)

Extraordinarily large kinetic isotope effect on alkene hydrogenation over Rh-based intermetallic compounds
by: Shinya Furukawa, et al.
Published: (2019-12-01)

Intermetallic compounds : principles and practise : v.3 progress /
by: Westbrook, Jack Hall, 1924-, et al.
Published: (2003)

Intermetallics /
by: 230421 Sauthoff, Gerhard
Published: (1995)

Intermetallic compounds : principles and practice /
by: Westbrook, Jack Hall, 1924-, et al.
Published: (1995)

The Evolution of Intermetallic Compounds in High-Entropy Alloys: From the Secondary Phase to the Main Phase
by: Junqi Liu, et al.
Published: (2021-12-01)

Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish /
by: Chia, Xing Nian, 1987-, et al.
Published: (2011)

Nanostructured Molybdenum Oxides from Aluminium-Based Intermetallic Compound: Synthesis and Application in Hydrogen Evolution Reaction
by: Deepti Raj, et al.
Published: (2021-05-01)

Structure data of elements and intermetallic phases/
by: 435354 Eckerlin, P., et al.
Published: (1971)

Intermetallics research progress /
by: Berdovsky, Yakov N.
Published: (c200)

Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finish [electronic resource] /
by: Chia, Xing Nian, 1987-, et al.
Published: (2011)

High temperature corrosion of intermetallics /
by: 441245 Li, Zhengwei, et al.
Published: (c200)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
by: Chua, Chai Ying, 1985-, et al.
Published: (2009)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
by: Noor Afzan Muhamad, 1985-, et al.
Published: (2008)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy /
by: 204538 Kee, Hang Ching
Published: (2003)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
by: 170422 Chua, Chai Ying, et al.
Published: (2009)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
by: 351526 Tan, Kok Hoong
Published: (2006)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
by: Noor Afzan Muhamad, 1985-
Published: (2008)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]
by: Koh, Joyce Swee Fong
Published: (2006)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
by: 351526 Tan, Kok Hoong
Published: (2006)

Recent progress in intermetallic nanocrystals for electrocatalysis: From binary to ternary to high‐entropy intermetallics
by: Jiawei Liu, et al.
Published: (2023-08-01)

Mechanochemical synthesis of intermetallic compounds in the system gallium – ruthenium
by: T. F. Grigoreva, et al.
Published: (2021-02-01)

Molten Salt Synthesis of Intermetallic Compound TiNi Nanopowder Passivated by TiO<sub>x</sub> Shell Prepared from NiTiO<sub>3</sub> for Catalytic Hydrogenation
by: Yasukazu Kobayashi, et al.
Published: (2022-11-01)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Microstructural Evolution of High-Entropy Intermetallic Compounds during Detonation Spraying
by: Ahmad Ostovari Moghaddam, et al.
Published: (2023-12-01)

Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish /
by: 285992 Yeap, Kong Boon
Published: (2005)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
by: Chin, Ee Mei, 1986-, et al.
Published: (2010)

Effect of flux type on intermetallics formation in solder joint /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Research Progress on Preparation Technology of Titanium Aluminum Alloy and its Intermetallic Compounds
by: Jiaming Guo, et al.
Published: (2022-06-01)

Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)

Study on the intermetallics formed at the interface between lead free solders and electroless nickel/immersion gold (ENIG) surface finish [compact disc] /
by: 285992 Yeap, Kong Boon
Published: (2005)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
by: Chin, Ee Mei, 1986-
Published: (2010)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
by: 285723 Yusreena Yusuf
Published: (2006)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
by: 380319 Ching, Sze Pei
Published: (2006)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
by: Tan, Luyeen, 1986-, et al.
Published: (2010)

Achieving High Self-Lubricating Performance of Al-Bi-Sm-Ti Alloys Based on the Intermetallic Compounds
by: Tiannan Man, et al.
Published: (2023-11-01)

The effect of composition on solid state transformation of Ti-Al based intermetallics /
by: 193741 Mohamad Khairul Abdul Khalek, et al.
Published: (2008)