Advanced materials for thermal management of electronic packaging /
Includes bibliographical references and index
| Main Author: | |
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| Format: | |
| Language: | eng |
| Published: |
New York ; London : Springer,
c201
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| Subjects: |
| _version_ | 1796738773971632128 |
|---|---|
| author | Tong, Xingcun Colin. |
| author_facet | Tong, Xingcun Colin. |
| author_sort | Tong, Xingcun Colin. |
| collection | OCEAN |
| description | Includes bibliographical references and index |
| first_indexed | 2024-03-05T11:06:47Z |
| format | |
| id | KOHA-OAI-TEST:452323 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T11:06:47Z |
| publishDate | c201 |
| publisher | New York ; London : Springer, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4523232020-12-19T17:16:27ZAdvanced materials for thermal management of electronic packaging / Tong, Xingcun Colin. New York ; London : Springer,c2011.engIncludes bibliographical references and indexPSZJBLElectronic apparatus and appliancesElectronic packagingURN:ISBN:9781441977588 (hbk)URN:ISBN:1441977589 (hbk)URN:ISBN:9781441977595 (ebk) |
| spellingShingle | Electronic apparatus and appliances Electronic packaging Tong, Xingcun Colin. Advanced materials for thermal management of electronic packaging / |
| title | Advanced materials for thermal management of electronic packaging / |
| title_full | Advanced materials for thermal management of electronic packaging / |
| title_fullStr | Advanced materials for thermal management of electronic packaging / |
| title_full_unstemmed | Advanced materials for thermal management of electronic packaging / |
| title_short | Advanced materials for thermal management of electronic packaging / |
| title_sort | advanced materials for thermal management of electronic packaging |
| topic | Electronic apparatus and appliances Electronic packaging |
| work_keys_str_mv | AT tongxingcuncolin advancedmaterialsforthermalmanagementofelectronicpackaging |