Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /

Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Author: Mohamad Idzwan Latiff, 1988-, author
Format:
Language:eng
Published: 2011
Subjects:
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author Mohamad Idzwan Latiff, 1988-, author
author_facet Mohamad Idzwan Latiff, 1988-, author
author_sort Mohamad Idzwan Latiff, 1988-, author
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011
first_indexed 2024-03-05T11:10:34Z
format
id KOHA-OAI-TEST:453585
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T11:10:34Z
publishDate 2011
record_format dspace
spelling KOHA-OAI-TEST:4535852020-12-19T17:16:31ZAdhesion of 10 mm coated aggregate for chip seal application [electronic resource] / Mohamad Idzwan Latiff, 1988-, author 2011engProject Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011Includes bibliographical referencesPSZJBLAdhesion
spellingShingle Adhesion
Mohamad Idzwan Latiff, 1988-, author
Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
title Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
title_full Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
title_fullStr Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
title_full_unstemmed Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
title_short Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
title_sort adhesion of 10 mm coated aggregate for chip seal application electronic resource
topic Adhesion
work_keys_str_mv AT mohamadidzwanlatiff1988author adhesionof10mmcoatedaggregateforchipsealapplicationelectronicresource