Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] /
Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011
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Language: | eng |
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2011
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_version_ | 1796739032204443648 |
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author | Mohamad Idzwan Latiff, 1988-, author |
author_facet | Mohamad Idzwan Latiff, 1988-, author |
author_sort | Mohamad Idzwan Latiff, 1988-, author |
collection | OCEAN |
description | Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011 |
first_indexed | 2024-03-05T11:10:34Z |
format | |
id | KOHA-OAI-TEST:453585 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T11:10:34Z |
publishDate | 2011 |
record_format | dspace |
spelling | KOHA-OAI-TEST:4535852020-12-19T17:16:31ZAdhesion of 10 mm coated aggregate for chip seal application [electronic resource] / Mohamad Idzwan Latiff, 1988-, author 2011engProject Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011Includes bibliographical referencesPSZJBLAdhesion |
spellingShingle | Adhesion Mohamad Idzwan Latiff, 1988-, author Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] / |
title | Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] / |
title_full | Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] / |
title_fullStr | Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] / |
title_full_unstemmed | Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] / |
title_short | Adhesion of 10 mm coated aggregate for chip seal application [electronic resource] / |
title_sort | adhesion of 10 mm coated aggregate for chip seal application electronic resource |
topic | Adhesion |
work_keys_str_mv | AT mohamadidzwanlatiff1988author adhesionof10mmcoatedaggregateforchipsealapplicationelectronicresource |