APA (7th ed.) Citation

Tea, S. T., Haryati Yaacob, s., & Awam, F. K. (2011). Adhesion of 10mm chip seal at different binder rate and aggregate rate.

Chicago Style (17th ed.) Citation

Tea, Siang Teck, supervisor Haryati Yaacob, and Fakulti Kejuruteraan Awam. Adhesion of 10mm Chip Seal at Different Binder Rate and Aggregate Rate. 2011.

MLA (9th ed.) Citation

Tea, Siang Teck, et al. Adhesion of 10mm Chip Seal at Different Binder Rate and Aggregate Rate. 2011.