Adhesion of 14mm coated aggregate for chip seal application /
Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011
Main Authors: | , , |
---|---|
פורמט: | |
שפה: | eng |
יצא לאור: |
2011
|
נושאים: |
_version_ | 1826447457342455808 |
---|---|
author | Nur Sarfina Nawawi, 1988-, author Haryati Yaacob, supervisor Fakulti Kejuruteraan Awam |
author_facet | Nur Sarfina Nawawi, 1988-, author Haryati Yaacob, supervisor Fakulti Kejuruteraan Awam |
author_sort | Nur Sarfina Nawawi, 1988-, author |
collection | OCEAN |
description | Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011 |
first_indexed | 2024-03-05T11:11:42Z |
format | |
id | KOHA-OAI-TEST:453962 |
institution | Universiti Teknologi Malaysia - OCEAN |
language | eng |
last_indexed | 2024-03-05T11:11:42Z |
publishDate | 2011 |
record_format | dspace |
spelling | KOHA-OAI-TEST:4539622020-12-19T17:16:32ZAdhesion of 14mm coated aggregate for chip seal application / Nur Sarfina Nawawi, 1988-, author Haryati Yaacob, supervisor Fakulti Kejuruteraan Awam 2011engProject Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011Includes bibliographical referencesFECELAdhesion |
spellingShingle | Adhesion Nur Sarfina Nawawi, 1988-, author Haryati Yaacob, supervisor Fakulti Kejuruteraan Awam Adhesion of 14mm coated aggregate for chip seal application / |
title | Adhesion of 14mm coated aggregate for chip seal application / |
title_full | Adhesion of 14mm coated aggregate for chip seal application / |
title_fullStr | Adhesion of 14mm coated aggregate for chip seal application / |
title_full_unstemmed | Adhesion of 14mm coated aggregate for chip seal application / |
title_short | Adhesion of 14mm coated aggregate for chip seal application / |
title_sort | adhesion of 14mm coated aggregate for chip seal application |
topic | Adhesion |
work_keys_str_mv | AT nursarfinanawawi1988author adhesionof14mmcoatedaggregateforchipsealapplication AT haryatiyaacobsupervisor adhesionof14mmcoatedaggregateforchipsealapplication AT fakultikejuruteraanawam adhesionof14mmcoatedaggregateforchipsealapplication |