Adhesion of 6mm coated aggregate for chip seal application /

Adhesion of 6mm coated aggregate for chip seal application /

Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Authors: Murni Mahadi, 1988-, author, Haryati Yaacob, supervisor, Fakulti Kejuruteraan Awam
Format:
Language:eng
Published: 2011
Subjects:
Adhesion
Description
Summary:Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011

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