Quality improvement of the wire bonding process in a semi conductor company /

Quality improvement of the wire bonding process in a semi conductor company /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Authors: Ng, Wei Kuo, 1987-, Wong, Kuan Yew, supervisor, Fakulti Kejuruteraan Mekanikal
Format:
Language:eng
Published: 2011
Subjects:
Total quality management
Description
Summary:Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2011

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