Quality improvement of the wire bonding process in a semi conductor company /

Quality improvement of the wire bonding process in a semi conductor company /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Authors:	Ng, Wei Kuo, 1987-, Wong, Kuan Yew, supervisor, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2011
Subjects:	Total quality management

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