Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Authors:	Koid, Chun Ping, 1987-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2011
Subjects:	Solder and soldering

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