Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
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| Language: | eng |
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2011
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| _version_ | 1826448705032552448 |
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| author | Koid, Chun Ping, 1987- |
| author_facet | Koid, Chun Ping, 1987- |
| author_sort | Koid, Chun Ping, 1987- |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011 |
| first_indexed | 2024-03-05T11:29:49Z |
| format | |
| id | KOHA-OAI-TEST:459984 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T11:29:49Z |
| publishDate | 2011 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4599842020-12-19T17:16:50ZEffect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / Koid, Chun Ping, 1987- 2011engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011Includes bibliographical referencesPSZJBLSolder and soldering |
| spellingShingle | Solder and soldering Koid, Chun Ping, 1987- Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / |
| title | Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / |
| title_full | Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / |
| title_fullStr | Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / |
| title_full_unstemmed | Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / |
| title_short | Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / |
| title_sort | effect of nickel doping in sn ag cu solder on intermetallic growth during soldering on ni p au surface finish electronic resource |
| topic | Solder and soldering |
| work_keys_str_mv | AT koidchunping1987 effectofnickeldopinginsnagcusolderonintermetallicgrowthduringsolderingonnipausurfacefinishelectronicresource |