Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011

Bibliographic Details
Main Author: Koid, Chun Ping, 1987-
Format:
Language:eng
Published: 2011
Subjects:
_version_ 1826448705032552448
author Koid, Chun Ping, 1987-
author_facet Koid, Chun Ping, 1987-
author_sort Koid, Chun Ping, 1987-
collection OCEAN
description Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
first_indexed 2024-03-05T11:29:49Z
format
id KOHA-OAI-TEST:459984
institution Universiti Teknologi Malaysia - OCEAN
language eng
last_indexed 2024-03-05T11:29:49Z
publishDate 2011
record_format dspace
spelling KOHA-OAI-TEST:4599842020-12-19T17:16:50ZEffect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] / Koid, Chun Ping, 1987- 2011engProject Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011Includes bibliographical referencesPSZJBLSolder and soldering
spellingShingle Solder and soldering
Koid, Chun Ping, 1987-
Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
title Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
title_full Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
title_fullStr Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
title_full_unstemmed Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
title_short Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
title_sort effect of nickel doping in sn ag cu solder on intermetallic growth during soldering on ni p au surface finish electronic resource
topic Solder and soldering
work_keys_str_mv AT koidchunping1987 effectofnickeldopinginsnagcusolderonintermetallicgrowthduringsolderingonnipausurfacefinishelectronicresource