Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish [electronic resource] /
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
| Κύριοι συγγραφείς: | , , |
|---|---|
| Μορφή: | |
| Γλώσσα: | eng |
| Έκδοση: |
2011
|
| Θέματα: |