Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010 /

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010 /

Includes bibliographical references and index

Bibliographic Details
Main Authors:	International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China), Wu, Yanwen
Format:
Language:	eng
Published:	Stafa-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, c201
Subjects:	Electronic apparatus and appliances Electronic packaging Microelectronic packaging Manufacturing processes

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