Semiconductor packaging : materials interaction and reliability /

Semiconductor packaging : materials interaction and reliability /

Includes bibliographical references and index

Detalhes bibliográficos
Principais autores: Chen, Andrea 526875, Lo, Randy 526876
Formato:
Idioma:eng
Publicado em: Boca Raton, FL : CRC Press, c201
Assuntos:
Microelectronic packaging

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