Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish [microfilm] /

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish [microfilm] /

Project Paper (Sarjana Muda) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author:	Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2006

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