Liu, Y. (2012). Power electronic packaging: Design, assembly process, reliability and modeling. New York : Springer.
Chicago Style (17th ed.) CitationLiu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. New York : Springer, 2012.
MLA (9th ed.) CitationLiu, Yong. Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling. New York : Springer, 2012.
Warning: These citations may not always be 100% accurate.